Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
October 2, 2007
Patent Application Number
11097323
Date Filed
April 4, 2005
Patent Primary Examiner
Patent abstract
The invention discloses a heat dissipation module. The heat dissipation module includes two separate cases and a porous structure. The cases are U-shaped and correspondingly connect to each other to form a sealed chamber. The porous structure is formed on an inner surface of the chamber. The heat dissipation module further includes at least one heat conducting structure connected to an exterior surface of the sealed chamber. The heat conducting structure may be fins or heat conducting plates connected to the chamber by welding, locking, fitting, engaging, or adhering.
Timeline
No Timeline data yet.
Further Resources
No Further Resources data yet.
