Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Yuzhuo Li0
Suryadevara V. Babu0
Stuart D. Hellring0
Satish Narayanan0
Robert L. Auger0
Colin P. McCann0
Date of Patent
October 9, 2007
Patent Application Number
10627776
Date Filed
July 28, 2003
Patent Citations Received
Patent Primary Examiner
Patent abstract
This invention relates to a silica, a slurry composition, and a method of their preparation. In particular, the silica of the present invention includes aggregated primary particles. The slurry composition which incorporates the silica, is suitable for polishing articles and especially useful for chemical-mechanical planarization of semiconductor substrates and other microelectronic substrates.
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