Patent 7279433 was granted and assigned to Freescale Semiconductor on October, 2007 by the United States Patent and Trademark Office.
A method for forming a dielectric layer is disclosed herein. In accordance with the method, a first material is provided (303) which comprises a suspension of nanoparticles in a liquid medium. A dielectric layer is then formed (305) on the substrate from the suspension through an evaporative process.