Is a
Patent attributes
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Chuan Hu0
Gregory M. Chrysler0
Ravi V. Mahajan0
Date of Patent
October 9, 2007
0Patent Application Number
106380380
Date Filed
August 8, 2003
0Patent Primary Examiner
Patent abstract
A microelectronic die is provided having an integrated thermoelectric module. The microelectronic die has a die substrate, a microelectronic circuit formed on a front side of the die substrate, and the thermoelectric module on a backside of the die substrate. Vias in the substrate interconnect the thermoelectric module with power and ground planes on the front side of the die substrate.
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