Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
October 9, 2007
Patent Application Number
10996722
Date Filed
November 24, 2004
Patent Primary Examiner
Patent abstract
One embodiment includes an electronic assembly having a first printed circuit board (PCB) coupled to a second PCB. The second PCB has at least two processors and is disposed above the first PCB. A thermal dissipation device is disposed above the second PCB, dissipates heat away from the two processors, and provides an airflow path. A power system is adjacent the thermal dissipation device and in a pathway of the airflow path.
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