Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
October 16, 2007
Patent Application Number
11013617
Date Filed
December 15, 2004
Patent Citations Received
Patent Primary Examiner
Patent abstract
A light emitting element is die-bonded to a portion of a lead frame exposed at the bottom of an opening formed at a top face of a resin package. A reflector to direct light emitted from the light emitting element towards a predetermined direction is attached to the top face of the resin package. Lead terminals are arranged so as to protrude from two opposite side regions of the resin package. A predetermined lead terminal among the plurality of lead terminals, connected to a portion where the light emitting element is die-bonded, is bent upwards, and soldered to the reflector by solder paste.
Timeline
No Timeline data yet.
Further Resources
No Further Resources data yet.
