US Patent 7285851 Liquid immersion cooled multichip module
Patent 7285851 was granted and assigned to Teradyne on October, 2007 by the United States Patent and Trademark Office.
Is a
Current Assignee
Date Filed
September 29, 2006
Date of Patent
October 23, 2007
Patent Application Number
11540391
Patent Jurisdiction
Patent Number
Patent Primary Examiner
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