Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
October 23, 2007
0Patent Application Number
110197300
Date Filed
December 21, 2004
0Patent Citations Received
Patent Primary Examiner
Patent abstract
Disclosed is a heatsink wherein a first bonding part for mounting the semiconductor component on a substrate and a second bonding part for mounting the heatsink on the substrate are soldered to the substrate by a common solder contact, so that the mounting the semiconductor component on the substrate, the mounting the heatsink on the substrate, and the fixing the heatsink to the semiconductor component can be implemented through a single soldering operation. Thus, the step of attaching the heatsink can be simplified. Since the solder is present in a clearance between the first and second bonding parts, the efficiency of heat dissipation can be enhanced.
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