Patent attributes
A heat dissipating device for a memory chip comprises a heat dissipating body; a middle section of each of two opposite sides of the heat dissipating body having a hook; a distal end of each hook being bent as a hooking end; wherein the hook can be hooked to the penetrating holes of a circuit board by the hooking ends to buckle the penetrating holes so as to fix a memory chip to the circuit board. Each of the four corners of the heat dissipating body is extended with a protrusion which is bent from the heat dissipating body to have the same orientation as the hook. The heat dissipating body has a recess at a center portion thereof. An outer side of the bending section is chamfered as a guiding angle. The hooking end may be a flat sheet, a cambered sheet or a U shape sheets.
