Patent attributes
The present invention discloses a pad and an electronic device employing the same, wherein the pad has an accommodating groove, a ditch disposed around the periphery of the accommodating groove, and at least one guiding groove disposed between the ditch and the accommodating groove, and one end of the guiding groove coupled to the ditch and the other end coupled to the accommodating groove; such that if a glue for attaching the pad with an electronic device is melted by heat, the melted glue will flow into the ditch, and thus can achieve the effects of preventing the melted glue flowing out from the body as well as guiding and collecting the melted glue within the body.