Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Yasunari Ooyabu0
Date of Patent
October 23, 2007
0Patent Application Number
111355110
Date Filed
May 24, 2005
0Patent Citations Received
Patent Primary Examiner
Patent abstract
A wired circuit board is provided that is formed by connecting a first wired circuit board and a second wired circuit board, which include a first connection terminal and a second connection terminal, respectively. A solder bump is provided to continuously extend over surfaces of the first connection terminal and the second connection terminal to mechanically couple the first wired circuit board and the second wired circuit board. Consequently, the solder bump is not interposed between opposed surfaces of the first connection terminal and the second connection terminal, thereby allowing the electrical connection provided by the solder bump to be confirmed by visual observation.
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