Is a
Patent attributes
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Khalid Mohamed0
Ilia Kalinovski0
Haruhiro Harry Goto0
Date of Patent
October 30, 2007
0Patent Application Number
108906530
Date Filed
July 13, 2004
0Patent Citations Received
Patent Primary Examiner
Patent abstract
The present invention pertains to methods for removing unwanted material from a semiconductor wafer during wafer manufacturing. More specifically, the invention pertains to stripping photo-resist material and removing etch-related residues from a semiconductor wafer. Methods involve implementing a plasma operation using hydrogen and a weak oxidizing agent, such as carbon dioxide. The invention is effective at stripping photo-resist and removing residues from low-k dielectric material used in Damascene devices.
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