Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Oded Meirav0
William Edward Burdick, Jr.0
Jerome Stephen Arenson0
David Michael Hoffman0
James Wilson Rose0
John Eric Tkaczyk0
Date of Patent
October 30, 2007
0Patent Application Number
109759520
Date Filed
October 28, 2004
0Patent Primary Examiner
Patent abstract
An interconnect structure for use in an electronic device, wherein the interconnect structure comprises a first substrate comprising a flexible material, wherein the first substrate comprises a front side and a back side, and wherein the first substrate is configured to receive a sensor on the front side; and a second substrate coupled to the back side of the first substrate and comprising a rigid material. A detector module for use in an imaging system comprises the aforementioned interconnect structure.
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