Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Tetsuo Hiramatsu0
Tsuyoshi Kaneko0
Date of Patent
November 6, 2007
Patent Application Number
10934379
Date Filed
September 7, 2004
Patent Primary Examiner
Patent abstract
An electrode forming method with an excellent yield, includes: (a) forming an adhesion preventing member having a predetermined pattern on a base member: (b) forming a conductive layer on the base member and the adhesion preventing member; and (c) forming an electrode having a predetermined pattern by removing the conductive layer on the adhesion preventing member in a state in which the adhesion preventing member is disposed on the base member. Adhesion between the adhesion preventing member and the conductive layer is smaller than adhesion between the base member and the conductive layer.
Timeline
No Timeline data yet.
Further Resources
No Further Resources data yet.