US Patent 7291904 Downsized package for electric wave device
All edits
Edits on 1 Sep, 2023
Golden AI
Edits made to:
Article (+365 characters)
Article
Patent abstract
A package substrate includes signal pads provided on a main surface of the package substrate, footpads provided on a backside of the package substrate, and a sealing electrode provided on the main surface to surround the signal pads, the signal pads being electrically coupled to the footpads, the sealing electrode being insulated from the footpads.
Edits on 19 May, 2023
Golden AI
Edits made to:
Infobox (-1 properties)
Infobox
Official Website
Golden AI
Edits made to:
Infobox (+1/-1 properties)
US Patent 07291904 Downsized package for electric wave device US Patent 7291904 Downsized package for electric wave device
Infobox
Patent Number
0729190400
Patent Number
729190400
Edits on 4 Apr, 2023
Golden AI
Infobox
Is a
Patent Jurisdiction
Patent Number
072919040
Date of Patent
November 6, 2007
0Patent Application Number
111152530
Date Filed
April 27, 2005
0Official Website
Patent Primary Examiner
Edits on 24 Sep, 2022
Golden AI
Infobox
Is a
Patent Jurisdiction
Patent Number
072919040
Date of Patent
November 6, 2007
0Patent Application Number
111152530
Date Filed
April 27, 2005
0Official Website
Patent Primary Examiner
Edits on 17 Jun, 2022
Golden AI
Edits made to:
Infobox (+1 properties)
Infobox
Website URL
Edits on 23 Nov, 2021
Golden AI
Edits made to:
Infobox (+7 properties)
US Patent 07291904 Downsized package for electric wave device
Infobox
Is a
Patent jurisdiction
Patent number
07291904
Date of patent
November 6, 2007
Patent application number
11115253
Date Filed
April 27, 2005
Patent primary examiner
Find more entities like US Patent 7291904 Downsized package for electric wave device
Use the Golden Query Tool to find similar entities by any field in the Knowledge Graph, including industry, location, and more.
