Patent attributes
A power semiconductor module has a substrate (1) on which several pressure elements (16, 17, 18, 19) perform a mechanical pressure (F) at different areas (10, 11, 12, 13) thereof in a direction of a cooling element in order to press the underside (1b) of the substrate and reject heat towards said cooling element. In order to apply an essentially even and non-influenced by the component tolerances force to each area of the substrate, the pressure elements perform an elastic action on the substrate areas. The pressure elements (16, 17, 18, 19) are formed on the first part (21) of a housing which is movable with respect to the second part (22) thereof provided with spacing elements (30, 31, 32, 33) defining a supporting surface (34) in such a way that the first part (21) of the housing is fixed at a certain distance from the substrate (1).
