US Patent 7292450 High density surface mount part array layout and assembly technique

Patent 7292450 was granted and assigned to Microsoft on November, 2007 by the United States Patent and Trademark Office.

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Patent

Patent attributes

Current Assignee

Microsoft

Patent Jurisdiction

United States Patent and Trademark Office

Patent Number

7292450

Date of Patent

November 6, 2007

Patent Application Number

11344276

Date Filed

January 31, 2006

Patent Primary Examiner

‌

Michael C. Zarroli

Patent abstract

A printed wiring assembly comprising, a printed wiring board, a ball grid array coupled to the printed wiring board, and a high density surface mount part array disposed on the printed wiring board.

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