Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
November 13, 2007
Patent Application Number
11262400
Date Filed
October 28, 2005
Patent Primary Examiner
Patent abstract
An electronics assembly is provided having a substrate and at least one electronics package supported on the substrate. The electronics package also has electrical circuitry and first and second side surfaces. The assembly further includes a first heat sink device positioned in thermal communication with the first side surface of the electronics package, and a second heat sink device positioned in thermal communication with the second side surface of the electronics package.
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