Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
November 20, 2007
Patent Application Number
11126052
Date Filed
May 9, 2005
Patent Citations Received
Patent Primary Examiner
Patent abstract
A method for fabricating a large die package with a leadframe having leads and a paddle is provided. An interposer is attached onto the leadframe with the interposer extending over at least a portion of the paddle and at least a portion of the leads of the lead-frame. The interposer is insulated from the leads. A die is attached to the interposer.
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