Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Tsz Yin Ho0
Dario S. Filoteo, Jr.0
Date of Patent
November 20, 2007
0Patent Application Number
113078610
Date Filed
February 25, 2006
0Patent Citations Received
Patent Primary Examiner
Patent abstract
An integrated circuit package system including a leadframe having an aperture provided therein and an integrated circuit package mounted to the leadframe over or under the aperture. A die is mounted within the aperture to the integrated circuit package and the die includes a plurality of the die.
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