US Patent 7298156 Electronic part test apparatus

A holding side contact arm (317) for holding an IC to be tested is positioned on the optical axis (OP) of an alignment CCD camera (326) of an alignment device (320), the IC to be tested is inserted to a first opening (321a) formed on an alignment movable portion (321), and a contact member (317d) of the holding side contact arm (317) is brought to contact the alignment movable portion (321). Then, an alignment amount for correcting a position of the IC to be tested is calculated by taking an image by the camera (326) and performing image processing. A lock-and-free means (318) provided to a first contact arm (315a1) is made to be in a non-restricted state, a movable portion driving device (322) is driven based on the alignment amount, and the holding side contact arm (317) contacting the alignment movable portion (321) is moved with respect to a root side contact arm (316), so that alignment of a position of the IC to be tested is performed.