Patent attributes
Disclosed is an electronic-component mounting apparatus 1 for mounting a plurality of electronic components onto a printed-wiring board 10, which comprises a component mounting head 4 adapted to suck up the electronic component and mount the sucked up electronic component on the printed-wiring board 10 while moving along an X-axis direction, a table 8 adapted to move the printed-wiring board 10 along a Y-axis direction, an electronic-component feeding device 12, 14 attached to the table 8 and adapted to move in sync with the movement of the printed-wiring board 10, and component image-recognition/correction means 16 for correcting a posture of the electronic component in accordance with image recognition of the posture, during the time between the sucking up and mounting of the electronic component by the component mounting head, wherein respective positions of the sucking of the electronic component, the mounting of the electronic component and the image recognition are located on the X-axis. The disclosed electronic-component feeding device includes a rectangular-pipe type and a plate type.
