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US Patent 7301771 Heat-receiving apparatus and electronic equipment

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Patent Inventor Names
Kentaro Tomioka0
Yukihiko Hata0
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Patent abstract

A heat-receiving plate of a pump has a heat-receiving surface and a guide. The heat-receiving surface is thermally connected to a heat-generating body. The guide is provided on the heat-receiving surface. The guide is opposed to the heat-generating body.

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Patent Citations Received
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US Patent 11714432 Flow-path controllers and related systems
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edited on 31 May, 2023
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Patent Citations Received
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US Patent 11662037 Fluid flow control valve for fluid flow systems, and methods
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Patent Citations Received
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US Patent 11661936 Sensors, multiplexed communication techniques, and related systems
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Official Website
https://pdfpiw.uspto.gov/.piw?Docid=073017710
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US Patent 07301771 Heat-receiving apparatus and electronic equipment US Patent 7301771 Heat-receiving apparatus and electronic equipment

Infobox
Patent Number
073017710
Patent Number
73017710
Edits on 28 Sep, 2022
"Entity importer update"
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edited on 28 Sep, 2022
Infobox
Is a
Patent
Patent
0
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
0
Patent Number
073017710
Date of Patent
November 27, 2007
0
Patent Application Number
110832670
Date Filed
March 17, 2005
0
Official Website
https://pdfpiw.uspto.gov/.piw?Docid=073017710
Patent Primary Examiner
‌
Boris Chervinsky
0
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"Entity importer update"
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Website URL
https://pdfpiw.uspto.gov/.piw?Docid=07301771
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created this topic on 23 Nov, 2021
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 US Patent 07301771 Heat-receiving apparatus and electronic equipment

Infobox
Is a
Patent
Patent
Patent jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
Patent number
07301771
Date of patent
November 27, 2007
Patent application number
11083267
Date Filed
March 17, 2005
Patent primary examiner
‌
Boris Chervinsky

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