Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
December 4, 2007
Patent Application Number
11204699
Date Filed
August 16, 2005
Patent Primary Examiner
Patent abstract
An improved Land Grid Array interconnect structure is provided with the use of small metal bumps on the substrate electrical contact pad. The bumps interlock with segments of the fuzz button connection and increase the physical contact surface area between the contact pad and fuss button. The improved contact reduces displacement of electrical contact points due to thermo-mechanical stress and lowers the required actuation force during assembly.
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