Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Hongyu Wang0
Joseph K. So0
Francis J. Kelley0
John Quanci0
Date of Patent
December 4, 2007
Patent Application Number
10882568
Date Filed
July 1, 2004
Patent Primary Examiner
Patent abstract
The present invention provides an aqueous composition useful for CMP of a semiconductor wafer containing a metal comprising oxidizer, inhibitor for a nonferrous metal, complexing agent for the nonferrous metal, modified cellulose, 0.001 to 10% by weight copolymer blends of a first copolymer and a second copolymer and balance water.
Timeline
No Timeline data yet.
Further Resources
No Further Resources data yet.
