Patent attributes
At least one semiconductor die is equipped with at least one RF transmitter, RF receiver and/or RF transceiver. This enables one or more RF links to be established with the die, enabling communications with the die to be effected with reduced or no wirebond or other physical connections. In another aspect of the invention, a source die with RF communication capability communicates with a target die by establishing an RF link with an intermediate RF device. The intermediate RF device has a physical connection, either directly to the target die, or to the substrate which they share, which allows the source die to communicate with the target die. The source and target dies may be on the same or on different substrates. This enables the use of multiple semiconductor dies and substrates in a manner which reduces the required physical connections between them.
