Patent attributes
Interconnection from a multidimensional transducer array to electronics is provided. Circuit board modules are used in combination with z-axis interconnections of a transducer array to provide active electronics within a volume adjacent to the multidimensional transducer array. By using multiple modules to connect to different regions of z-axis interconnects, conductor paths from the transducer to the electronics are more likely of similar lengths. By including a thin or thinner region on each of the modules for active electronics, a greater volume of the space adjacent to the transducer array may include active electronics. Thicker regions route conductors from the 2D array regions, and thinner regions provide space for active electronics. Using multiple modules with z-axis interconnects may reduce cross-talk and space requirements for implementing some or all of the transmit and/or receive beamformation adjacent to the multidimensional transducer array. Additionally or alternatively, other electronics than beamformation components are provided on the modules.
