US Patent 7306959 Methods of fabricating integrated optoelectronic devices
Patent 7306959 was granted and assigned to Finisar on December, 2007 by the United States Patent and Trademark Office.
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This disclosure concerns methods for fabrication of integrated high speed optoelectronic devices. In one example of such a method, a device region that includes a top surface and a bottom surface is formed on a top surface of a substrate. The device region may take the form of an optical emitter, such as a VCSEL, or a detector, such as a photodiode. Next, an isolation region is formed that is configured such that the device region is surrounded by the isolation region. A superstrate is then disposed on the top surface of the device region. Finally, a micro-optical device, such as a lens, is placed on a top surface of the superstrate.
US Patent 07306959 Methods of fabricating integrated optoelectronic devices US Patent 7306959 Methods of fabricating integrated optoelectronic devices
US Patent 07306959 Methods of fabricating integrated optoelectronic devices
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