Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Yuji Sakai0
Date of Patent
December 11, 2007
0Patent Application Number
113492000
Date Filed
February 8, 2006
0Patent Primary Examiner
Patent abstract
A semiconductor device includes a memory module board mounting thereon a plurality of DRAM devices, and a mount board mounting thereon the memory module board via a combination of socket and plug. The socket formed on the mount board has a pair of heat radiation guide plates attached onto the side surfaces of the socket. The heat radiation plates have a thermal conductivity of 1 watt/meter·K. The surface of the mount board onto which the socket is attached is a conductive sheet having a thermal conductivity of 1 watt/meter·K.
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