US Patent 7308206 Heatsinking of optical subassembly and method of assembling
Patent 7308206 was granted and assigned to Finisar on December, 2007 by the United States Patent and Trademark Office.
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Patent abstract
An optical transceiver has a housing, a circuit board, an optical subassembly and a heat wick. The circuit board is configured to be received within the housing. The optical subassembly has a can and a barrel, and the optical subassembly is mechanically supported on the housing and electrically coupled to the circuit board. The heat wick is thermally coupled between the can of the optical assembly and the housing.
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US Patent 07308206 Heatsinking of optical subassembly and method of assembling US Patent 7308206 Heatsinking of optical subassembly and method of assembling
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Patent Number
0730820600
Patent Number
730820600
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Official Website
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Infobox
Is a
Current Assignee
Patent Jurisdiction
Patent Number
073082060
Date of Patent
December 11, 2007
0Patent Application Number
107611060
Date Filed
January 20, 2004
0Official Website
Patent Primary Examiner
Edits on 26 Sep, 2022
Golden AI
Infobox
Is a
Current Assignee
Patent Jurisdiction
Patent Number
073082060
Date of Patent
December 11, 2007
0Patent Application Number
107611060
Date Filed
January 20, 2004
0Official Website
Patent Primary Examiner
Edits on 17 Jun, 2022
Golden AI
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Edits on 23 Nov, 2021
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US Patent 07308206 Heatsinking of optical subassembly and method of assembling
Infobox
Is a
Current assignee
Patent jurisdiction
Patent number
07308206
Date of patent
December 11, 2007
Patent application number
10761106
Date Filed
January 20, 2004
Patent primary examiner
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