Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
December 18, 2007
Patent Application Number
11063065
Date Filed
February 22, 2005
Patent Primary Examiner
Patent abstract
A low profile connector assembly comprises at least one contact having a surface mount portion and a wire engagement portion extending from the surface mount portion, and a housing insertable over the at least one contact and retained to the at least one contact. The housing encloses the wire engagement portion and has a wire receiving aperture therethrough. The wire receiving aperture provides access to the wire engagement portion when the housing is retained to the contact.
Timeline
No Timeline data yet.
Further Resources
No Further Resources data yet.