US Patent 7309374 Diffusion bonded nickel-copper powder metallurgy powder
All edits
Edits on 16 Sep, 2023
Golden AI
Edits made to:
Infobox (+4 properties)
Infobox
Patent Inventor Names
Ouan Min Yang0
Scott Thomas Campbell0
Tajpreet Singh0
Thomas Francis Stephenson0
Edits on 1 Sep, 2023
Golden AI
Edits made to:
Article (+485 characters)
Article
Patent abstract
In contrast to current industrial practice where alloying powders are added to starting powder metallurgy compositions either as powder mixtures or fully prealloyed powders, the present invention posits a diffusion bonded nickel-copper precursor additive mixture for direct one step addition to the starting powder metallurgy master blend composition. Segregation and dusting are substantially reduced and the mechanical properties of the resultant compact are improved.
Edits on 26 May, 2023
Golden AI
Edits made to:
Infobox (-1 properties)
Infobox
Official Website
Edits on 19 May, 2023
Golden AI
Edits made to:
Infobox (+1/-1 properties)
US Patent 07309374 Diffusion bonded nickel-copper powder metallurgy powder US Patent 7309374 Diffusion bonded nickel-copper powder metallurgy powder
Infobox
Patent Number
07309374
Patent Number
7309374
Edits on 17 Jun, 2022
Golden AI
Edits made to:
Infobox (+1 properties)
Infobox
Website URL
Edits on 23 Nov, 2021
Golden AI
Edits made to:
Infobox (+7 properties)
US Patent 07309374 Diffusion bonded nickel-copper powder metallurgy powder
Infobox
Is a
Patent jurisdiction
Patent number
07309374
Date of patent
December 18, 2007
Patent application number
11098693
Date Filed
April 4, 2005
Patent primary examiner
Find more entities like US Patent 7309374 Diffusion bonded nickel-copper powder metallurgy powder
Use the Golden Query Tool to find similar entities by any field in the Knowledge Graph, including industry, location, and more.
