Patent attributes
A method of employing a plurality of integrated circuits in a multi-chip module is described. The method comprises steps of identifying a defective programmable logic device implemented on a first die; identifying a functional programmable logic device implemented on a second die; and coupling the defective programmable logic device and the functional programmable logic device. According to an alternate embodiment, a method of employing a plurality of integrated circuits in a multi-chip module comprises steps of configuring a plurality of programmable logic devices on a multi-chip module. A multi-chip integrated circuit package is also described.