Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
December 25, 2007
Patent Application Number
10709518
Date Filed
May 11, 2004
Patent Citations Received
Patent Primary Examiner
Patent abstract
A reworkable conductive adhesive composition, and method of making such, comprising an epoxy based conductive adhesive containing conductive metal filler particles dispersed in a solvent-free hybrid epoxy polymer matrix. In an additional embodiment an improved method of removing cured conductive polymer adhesives, disclosed here as thermal interface materials, from electronic components for reclamation or recovery of usable parts of module assemblies, particularly high cost semiconductor devices, heat sinks and other module components.
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