Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
December 25, 2007
Patent Application Number
11231746
Date Filed
September 22, 2005
Patent Primary Examiner
Patent abstract
A circuit component mounting device includes a resin substrate, vias, a circuit component composed of a main body and electrode portions, a solder, and an insulative sealing resin that covers the circuit component and the solder. The device further includes a base metal pattern which covers parts of the principal face of the resin substrate where the vias are exposed and is composed of a Cu layer and a Ni layer and a copper plated pattern which is provided on the base metal pattern and is composed of a Cu layer, a Ni layer, and an Au layer. The circuit component is provided on the copper plated pattern. The solder allows the copper plated pattern and the circuit component to adhere to each other.
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