Patent attributes
Some embodiments provide a configurable integrated circuit (“IC”) with a configurable node array. A configurable node array may include configurable nodes arranged in rows and columns. It may also include direct offset connections, with each direct offset connection connecting two nodes that are neither in the same column nor the same row. In some embodiments, at least some direct offset connections connect pairs of nodes that are separated by more than one row and at least one column, or by more than one column and at least one row. Some embodiments establish a direct connection by a set of wire segments that traverse through a set of the IC's wiring layers, and a set of vias when multiple wiring layers are involved. Some of the direct connections may have intervening circuits (e.g. buffer circuits). In some embodiments, the nodes in the array are all similar to each other.
