US Patent 7314599 Paek embossing and adhesion for microfluidic devices
Patent 7314599 was granted and assigned to Agilent Technologies on January, 2008 by the United States Patent and Trademark Office.
Is a
Current Assignee
Date Filed
April 2, 2002
0
Date of Patent
January 1, 2008
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Patent Application Number
10114801
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Patent Inventor Names
Hongfeng Yin
0
Daniel B. Roitman
0
Karen L. Seaward
0
Karla Robotti
0
Kevin P. Killeen
0
Patent Jurisdiction
Patent Number
Patent Primary Examiner
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