Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Tiao Zhou0
Michael J. Hundt0
Date of Patent
January 1, 2008
0Patent Application Number
117099280
Date Filed
February 20, 2007
0Patent Primary Examiner
Patent abstract
A thermally-enhanced ball grid array package structure is provided that includes an integrated circuit chip, a heat spreader and a substrate. The integrated circuit chip has a specified surface area. The heat spreader is coupled to the integrated circuit chip. The substrate is coupled to the heat spreader. The substrate has a specified surface area. The heat spreader covers a specified portion of the surface area of the substrate that is greater than the surface area of the integrated circuit chip. The heat spreader is operable to dissipate heat from the integrated circuit chip over the specified portion of the surface area of the substrate.
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