Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Timothy H. Daubenspeck0
Wolfgang Sauter0
Christopher D. Muzzy0
Jeffrey P. Gambino0
Date of Patent
January 8, 2008
0Patent Application Number
107113670
Date Filed
September 14, 2004
0Patent Primary Examiner
Patent abstract
A wire bond pad and method of fabricating the wire bond pad. The method including: providing a substrate; forming an electrically conductive layer on a top surface of the substrate; patterning the conductive layer into a plurality of wire bond pads spaced apart; and forming a protective dielectric layer on the top surface of the substrate in spaces between adjacent wire bond pads, top surfaces of the dielectric layer in the spaces coplanar with coplanar top surfaces of the wire bond pads.
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