US Patent 7317258 Thermal interface apparatus, systems, and fabrication methods

Patent 7317258 was granted and assigned to Intel on January, 2008 by the United States Patent and Trademark Office.

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Patent

Patent attributes

Current Assignee

Intel

Patent Jurisdiction

United States Patent and Trademark Office

Patent Number

73172580

Patent Inventor Names

Rajen C. Dias0

Yongmei Liu0

Date of Patent

January 8, 2008

Patent Application Number

113687080

Date Filed

March 6, 2006

Patent Primary Examiner

‌

Cathy F. Lam

Patent abstract

An apparatus and system, as well as fabrication methods therefor, may include a unitary, substantially uniformly distributed transfer material coupled to a carrier material.

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