Is a
Patent attributes
Current Assignee
Patent Jurisdiction
Patent Number
Date of Patent
January 15, 2008
Patent Application Number
11358537
Date Filed
February 21, 2006
Patent Primary Examiner
Patent abstract
Disclosed herein is an optical modulator module package structure. In the optical modulator module package structure, an optical modulator device and a drive integrated circuit device are flip-chip bonded to a substrate, and an opening of the substrate is blocked using a piece of glass.
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