Is a
Patent attributes
Current Assignee
Patent Jurisdiction
Patent Number
Date of Patent
January 15, 2008
Patent Application Number
10975690
Date Filed
October 27, 2004
Patent Citations Received
Patent Primary Examiner
Patent abstract
According to an embodiment of the present invention, a system includes an integrated circuit coupled to a circuit board and a heat conducting element having a thermal conductivity of at least 391 W/m*K. The heat conducting element includes a flexible portion disposed between first and second solid portions, wherein the first solid portion is coupled to the integrated circuit and the second solid portion is coupled to a heat sink.
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