US Patent 7322673 Printhead assembly with heat sink for drive circuitry

A printhead assembly with at least two printhead integrated circuits (IC's), each having arrays of printing fluid ejection nozzles. A support member in the assembly supports and carries the printing fluid fed to the at least two printhead integrated circuits. Drive circuitry for controlling the operation of the printhead IC's has an electrical connector for connecting the drive circuitry to the at least two printhead integrated circuits. The assembly has a casing for supporting the printhead IC's, the support member, the drive circuitry and the electrical connector within an inkjet printer, wherein, the casing has a heat sink to draw heat away from the drive circuitry.