Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
January 29, 2008
0Patent Application Number
100382760
Date Filed
January 2, 2002
0Patent Citations Received
...
Patent Primary Examiner
Patent abstract
A substrate with hermetically sealed vias extending from one side of the substrate to another and a method for fabricating same. The vias may be filled with a conductive material such as, for example, a fritless ink. The conductive path formed by the conductive material aids in sealing one side of the substrate from another. One side of the substrate may include a sensing element and another side of the substrate may include sensing electronics.
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