Is a
Patent attributes
Current Assignee
Patent Jurisdiction
Patent Number
Date of Patent
January 29, 2008
0Patent Application Number
112799720
Date Filed
April 17, 2006
0Patent Primary Examiner
Patent abstract
A method of forming a package is disclosed, which includes steps of forming a substrate, a solder masker, and a first aperture through the solder mask. The substrate has a surface on which metal traces are formed. The solder mask covers at least a portion of the surface of the substrate. And the first aperture through the solder mask exposes a plurality of the metal traces.
Timeline
No Timeline data yet.
Further Resources
No Further Resources data yet.
