Patent attributes
Provided is a wiring board including an insulating substrate with a first region and a second region adjacent to each other on a major surface, signal line groups arrayed on the first region, and connection portions arranged on the second region in correspondence with the signal line groups, wherein each connection portion includes first to third terminal groups, a first wiring line group connecting the first terminal group to the corresponding signal line group, a second wiring line group connected to the second terminal group, and a third wiring group connected to the third terminal group, wherein the second and third wiring line groups are connected to each other between each adjacent connection portions, and all of the connection portions are the same in shapes of the first to third terminal groups and the first to third wiring line groups.
