US Patent 7325300 Method of manufacturing printed wiring boards
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Patent Inventor Names
Kiyohide Tatsumi0
Shinji Nakamura0
Toshihiro Nishii0
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Patent abstract
In a heat and press stage of manufacturing printed wiring boards, a functional surface layer having release property is provided on a surface of a cushion, and a blocking layer is prepared between the functional surface layer and an inner layer having cushion property so that a frequency of use of the cushion can be increased.
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US Patent 07325300 Method of manufacturing printed wiring boards US Patent 7325300 Method of manufacturing printed wiring boards
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Patent Number
073253000
Patent Number
73253000
Edits on 23 May, 2023
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Official Website
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Patent Jurisdiction
Patent Number
073253000
Date of Patent
February 5, 2008
0Patent Application Number
104683610
Date Filed
October 11, 2002
0Official Website
Patent Primary Examiner
Edits on 17 Jun, 2022
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US Patent 07325300 Method of manufacturing printed wiring boards
Infobox
Is a
Patent jurisdiction
Patent number
07325300
Date of patent
February 5, 2008
Patent application number
10468361
Date Filed
October 11, 2002
Patent primary examiner
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