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US Patent 7326327 Rhodium electroplated structures and methods of making same

Patent 7326327 was granted and assigned to FormFactor on February, 2008 by the United States Patent and Trademark Office.

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Patent attributes

Current Assignee

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Patent Jurisdiction

United States Patent and Trademark Office

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Patent Number

Patent Inventor Names

Greg Omweg0

Gayle Herman0

Michael Armstrong0

Ravindra V. Shenoy0

Date of Patent

February 5, 2008

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Patent Application Number

104563430

Date Filed

June 6, 2003

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Patent Citations Received

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Patent Primary Examiner

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Patent abstract

A halide based stress reducing agent is added to the bath of a rhodium plating solution. The stress reducing agent reduces stress in the plated rhodium, increasing the thickness of the rhodium that can be plated without cracking. In addition, the stress reducing agent does not appreciably decrease the wear resistance or hardness of the plated rhodium.

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