Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
February 5, 2008
Patent Application Number
10974772
Date Filed
October 28, 2004
Patent Primary Examiner
Patent abstract
A method for manufacturing a ball grid array package includes the steps of providing a substrate strip having a plurality of sub-substrate strips wherein each has an upper surface and a lower surface, disposing a plurality of chips on the upper surfaces of the sub-substrate strips, forming a plurality of encapsulation bodies for encapsulating the chips on the upper surfaces respectively, and forming a plurality of ribs between the encapsulation bodies.
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