Is a
Patent attributes
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Tian H. Lim0
Ellie Yieh0
Frederic Gaillard0
Li-Qun Xia0
Date of Patent
February 5, 2008
0Patent Application Number
109902510
Date Filed
November 15, 2004
0Patent Primary Examiner
Patent abstract
A method for providing a dielectric film having enhanced adhesion and stability. The method includes a post deposition treatment that densifies the film in a reducing atmosphere to enhance stability if the film is to be cured ex-situ. The densification generally takes place in a reducing environment while heating the substrate. The densification treatment is particularly suitable for silicon-oxygen-carbon low dielectric constant films that have been deposited at low temperature.
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